SK Hynix CEO Kwak No-jung reportedly accompanied Chey on the visit, which marks the chairman's first publicly known trip to Taiwan in 10 months. During his previous visit in June 2024, Chey met with TSMC Chairman Mark Liu and proposed "opening the foundation for an AI era that benefits humanity together," while agreeing to strengthen cooperation between the two companies in the high-bandwidth memory (HBM) sector.
SK Hynix had previously signed a memorandum of understanding (MOU) with TSMC in April 2024 for technical cooperation on developing HBM4, the sixth generation of high-bandwidth memory, and enhancing advanced packaging technology capabilities. This latest visit appears to continue discussions on collaboration opportunities in AI and semiconductor technologies with key figures in Taiwan's IT industry.
The visit comes as memory manufacturers worldwide are racing to secure their positions in the growing AI semiconductor market, with HBM chips playing a crucial role as they provide the high-speed data processing capabilities required for AI applications. TSMC, as the world's leading semiconductor foundry, is a vital partner for memory manufacturers seeking to advance their high-performance computing solutions.
SK Hynix is scheduled to participate in the "TSMC 2025 Technology Symposium" on April 23 in Santa Clara, California, where it plans to showcase its HBM4 and cutting-edge packaging technologies. This event will provide SK Hynix with an opportunity to demonstrate its latest innovations to potential partners and customers in the global semiconductor ecosystem.
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Candice Kim
candicekim1121@ajupress.com
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