SEOUL, February 18 (AJP) - SK hynix has appointed Lee Woong-sun as president of its newly established West Lafayette LLC subsidiary in Indiana, which will oversee the company's semiconductor packaging operations in the United States.
The appointment follows SK hynix's announcement in April 2024 to invest $3.87 billion in building an advanced packaging facility for AI memory chips in West Lafayette, Indiana.
The facility, scheduled to begin mass production of next-generation High Bandwidth Memory (HBM) products in the second half of 2028, will also collaborate with local research institutions including Purdue University.
Lee, who joined SK hynix in 2005, has extensive experience in packaging R&D and wafer-level packaging manufacturing technology, contributing to the development and mass production of HBM products.
The company has been strengthening its HBM operations in the United States, recently appointing Ryu Sung-soo, who specializes in DRAM product planning and HBM business, as the new head of SK hynix America.
The Silicon Valley-based subsidiary in San Jose, California, serves as a communication channel between the company and its customers during HBM verification and mass production processes.
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